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Key Features and Functions:
Anti-Splatter Protection: It prevents the formation of uneven solder balls and "bursting" caused by pad oxidation or stencil protrusion during heating.
High-Temperature Resistance: Made from ultra-clear, explosion-proof glass, it can withstand extreme heat without cracking, maintaining high thermal conductivity to ensure even heating of the chip.
Stencil Stability: It solves the issue of steel reballing meshes bulging or deforming under heat, ensuring a flat surface for precise soldering.
Clear Visibility: The transparent glass allows technicians to monitor the soldering process in real-time while protecting the surrounding workspace.
Technical Specifications:
Material: Impact-resistant and heat-resistant ultra-white glass.
Size: Standard units are typically around 20x20mm for precision soldering.
Durability: Designed to maintain its color and adhesion under high-temperature soldering conditions without peeling.
