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* Sealed cover
* Strong sealing
* Large thickness/firm
* Long Mouth design
* 20ml Container
Feature:
1. Specially formulated BGA flux paste for lead-free electronics soldering.
2. Rosin-based flux for effective soldering and flux removal.
3. Comes in a convenient 20ml container for easy application.
4. Ensures strong and reliable solder joints.
5. Suitable for a wide range of electronics soldering applications.
Packing Details:
